Date Board Name
  P/N Revision
  Layers Board Size X
  Thickness Material
 

Array?

Yes No Array Size X
  Pieces/Array X-outs Allowed
  Electric Test? Yes No Quantity Pads to Test
  Smallest Pitch Min Line/Space
  Min Hole/Pad / Total Holes
  Total Drills Cu Plating= min Avg in Holes
  Cu Weight Outer oz Internal Signal oz
  Internal Plane oz Surface Finish
  Comment Gold I/O Fingers #Edges
  Au= Micro"Over Ni Micro"
  Solder Mask Color
LPI Yes or Other
  Silkscreen Color    

 

 

Impedance Z
  Line Size = ohms Line Size = ohms    
  Line Size = ohms Line Size = ohms    

 

 

Differential Impedance
  Line/Space / =ohms  

 

 

 

Special Notes on Impedance

*See Comments Section if Blind/Buried Vias or Buried Capacitance Required

   
  Quantity of Boards Received In Days
  Quantity of Boards Received In Days
  Quantity of Boards Received In Days

 

  Comments  
   
   

 

 

 

 

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